In general, you see that this training in particular, is followed by companies working in the military segment, aviation and space travel, and companies that produce electronics for these types of customers.
Ultimately, this training is suitable for many more other segments. PIEK: Your knowledge provider for the electronics industry. During this training you particularly learn about the production processes and the importance of process control within those production processes. You learn which materials you can or cannot use for certain products, the tools that are used, but also the cleanliness tests that must be done.
You also learn what the tolerances are for the electronic products with regard to solder connections. You also have to make it solder connections yourself and inspect these connections learned in practice.
There is a practical element of this training. The added value of this training and certification is the accuracy with regard to setting up the automated soldering processes and possibly the manual soldering processes within a company. The document deals in particular with specific matters within those soldering processes, such as materials and tools that must be used. But also the documentation that is required in these processes within the framework of a process control system.
In addition, people have learned how to inspect solder connections and what the requirements are for these connections and have had to make a number of connections themselves and thereafter they have to inspect their own work.
This is the added value of this training. This has a validity of 2 years. You must recertify within 6 months before the certificate expires. You have the following options for recertification:. These experts are often used by companies as coordinators to correctly apply the standard within the company.
Please do not hesitate to contact us for a complete training program, more information, or other training-related issues. No, process control is only mandatory for high reliability products class 3. For class 2 it is recommended but not mandatory. For further information: see J-STD standard. This again depends on the product class. For class 1 and 2 products it is recommended to train the production personnel in the assembly department.
In class 3 it is mandatory to follow a soldering training before you are allowed to work on these products. IPC prescribes that the inspection magnification for cleanliness can take place without magnification with bare eyes.
In the tables in the standards you will find exactly which inspection magnification and referee magnification factor is required. This is described in the J-STD The contamination that remains after soldering is mainly flux residue, but dust and other particles hair, tin splashes, solder balls, finger spots, etc.
Is this allowed and how much FOD may be left behind? This depends on the product class. This is also described in the J-STD Class 1 products may be repaired at any time. Whereas, J-STD provides best practices to follow for process engineers, supervisors, and technicians. In any standard, there is an emphasis on some of the major aspects along with minor provisions. While speaking of soldering, it is crucial to consider the general parameters from the joint industry standards.
See the following points for soldering:. There are many requirements related to wires, strands, lead forming, defects as per material classes, holes, lamination, etc.
It is necessary to follow this standard and maintain proper documentation for results and findings. It consists of several process requirements. Some important ones include:. For using silver-coated copper conductors, a user-approved red plague corrosion control plan is essential.
The purpose of this plan is to minimize and control the exposure to certain environmental conditions that promote the growth of cupric oxide CuO corrosion and latent damage. When the main constituents of the processes e. Additionally, solder alloys that have a good service life, performance, and reliability are also acceptable. For using different activity levels of flux, it is essential to test the process compatibility.
Solder paste testing is also necessary to check the paste spread and occurrence of solder balls due to oxidation. Chemical strippers are flux removers that clean off the flux after completing soldering on a PCB. These exist in the form of chemical solutions, pastes, or creams.
Chemical strippers should be selected such that they do not cause any damage or degradation. While performing soldering or reworking, it is vital to protect the component from excessive heating and thermal shocks. It is achieved by implementing a heat sink , thermal shunt, or preheating. The component heat sensitivity levels should be checked and recommended guidelines are followed to avoid any risk. To study vibration effects, design considerations for assembly, and modes of heat transfer in space vehicles, see how vibrations in space vehicles affect PCBA.
Sometimes, design restrictions stipulate the mounting of components that are incapable of withstanding soldering temperatures associated with a given process. In such cases, components are mounted and soldered with a suitable method that will help to attain the necessary temperature.
There should be enough clearance between the parts to perform sufficient cleaning and cleanliness testing. Download IPC specification tree 10Kb. All the downloads require Acrobat Reader click here to download the latest version IPC Specification Tree Using this guide you can ensure that you have all the specifications you need. Pen and ink changes should be made in accordance with your company's document control policies. Amendment 1 addresses Telcordia Technologies' formerly Bellcore's position towards this standard.
It calls out newly revised test methods and updated requirements for formulation change. IPC Voluntary Safety Standard for Electrically Heated Process Equipment This voluntary standard establishes minimum requirements for the design, installation, operation and maintenance of electrically heated process equipment in order to minimize electrical hazards and prevent fires that may occur in combustible tanks, tank liners and drying equipment.
Download IPC Kb. IPC Amendment 1 Generic Standard on Printed Board Design The January release of Amendment 1 for the IPC standard provides expanded coverage of plated-through hole test specimens in addition to a new test specimen for the purpose of evaluating bending flexibility and endurance for flexible printed wiring applications.
This amendment also includes updated figures for etched conductor characteristics and printed board size standardisation. Includes information on conformance to both fabricator and customer design rules and can be used by printed board designers as an output quality check.
Amendment 1 for the IPCA includes updating of the plating requirements for electrodeposited copper, as well as corrections to specifications for metal core printed boards following industry use of IPCA. Corrections have also been made for the tables highlighting internal layer thickness as well as external conductor thickness after plating. IPC, Amendment 1, includes corrections noticed by industry following the publication and regular use of IPC In addition to technical changes to the requirements in Section 3, the qualification and conformance testing, sampling plan, acceptance testing and qualification tables have been updated.
Just like IPC, Appendix 1 now serves as a requirements cross reference.
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